Any thoughts on this. It seems pretty obvious as a development once you get into it and there doesn’t seem to be much difference between the new patent and the expired patent. Layer adhesion is the big Achilles heel of 3D printing after all.
Yeah, honestly that was at least partially my thought process posting this. I see someone else posted the same video and got a bit more traction as well, which is great: the more eyes on this, the more likely someone chooses to develop it. If someone develops a fork or plugin for various open source slicers, it’s usefulness should quickly become obvious and someone with deeper pockets will wind up going after the BS patent. Even as little as a 10% improvement in layer adhesion, if it’s reliable and consistent, is a significant upgrade. The old saying about a chain only being as strong as the weakest link comes to mind and layer adhesion is the weakest link in 3d printing.
